Item 15. EXHIBITS, FINANCIAL STATEMENT SCHEDULES

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Item 15. EXHIBITS, FINANCIAL STATEMENT SCHEDULES

(a) The following documents are filed as part of this report:

1.Financial Statements: See Index to Consolidated Financial Statements under Item 8.
2.Financial Statement Schedules: Schedule I – Condensed Financial Information of the Registrant Schedule II – Valuation and Qualifying Accounts Certain Financial Statement Schedules have been omitted since they are either not required, not applicable, or the information is otherwise included.
3.Exhibits.

SCHEDULE I

CONDENSED FINANCIAL INFORMATION OF THE REGISTRANT

MICRON TECHNOLOGY, INC.

(Parent Company Only)

CONDENSED STATEMENTS OF OPERATIONS AND COMPREHENSIVE INCOME (LOSS)

(in millions)

For the year endedAugust 31, 2017September 1, 2016September 3, 2015
Net sales$5,652$5,529$5,547
Costs and expenses
Cost of goods sold3,4783,6253,329
Selling, general, and administrative331266299
Research and development1,5511,5001,483
Other operating (income) expense, net—26(12)
Total costs and expenses5,3605,4175,099
Operating income292112448
Interest income (expense), net(366)(348)(273)
Other non-operating income (expense), net(69)182(85)
(143)(54)90
Income tax (provision) benefit221038
Equity in earnings (loss) of subsidiaries5,210(224)2,773
Equity in net loss of equity method investees—(8)(2)
Net income (loss) attributable to Micron5,089(276)2,899
Other comprehensive income (loss)64(48)(43)
Comprehensive income (loss) attributable to Micron$5,153$(324)$2,856

See accompanying notes to condensed financial statements.

SCHEDULE I

CONDENSED FINANCIAL INFORMATION OF THE REGISTRANT

MICRON TECHNOLOGY, INC.

(Parent Company Only)

CONDENSED BALANCE SHEETS

(in millions except par value amounts)

As ofAugust 31, 2017September 1, 2016
Assets
Cash and equivalents$2,197$2,716
Short-term investments319258
Receivables112102
Notes and accounts receivable from subsidiaries1,4701,159
Finished goods4749
Work in process215244
Raw materials and supplies8991
Other current assets4254
Total current assets4,4914,673
Investment in subsidiaries18,16912,897
Long-term marketable investments617414
Noncurrent notes receivable from and prepaid expenses to subsidiaries616709
Property, plant, and equipment, net2,3302,026
Other noncurrent assets335412
Total assets$26,558$21,131
Liabilities and equity
Accounts payable and accrued expenses$929$916
Short-term debt and accounts payable to subsidiaries700314
Current debt53075
Other current liabilities916
Total current liabilities2,1681,321
Long-term debt5,3207,313
Other noncurrent liabilities428417
Total liabilities7,9169,051
Commitments and contingencies
Redeemable convertible notes21—
Micron shareholders' equity
Common stock, $0.10 par value, 3,000 shares authorized, 1,116 shares issued and 1,112 outstanding (1,094 issued and 1,040 outstanding as of September 1, 2016)112109
Other equity18,50911,971
Total Micron shareholders' equity18,62112,080
Total liabilities and equity$26,558$21,131

See accompanying notes to condensed financial statements.

SCHEDULE I

CONDENSED FINANCIAL INFORMATION OF THE REGISTRANT

MICRON TECHNOLOGY, INC.

(Parent Company Only)

CONDENSED STATEMENTS OF CASH FLOWS

(in millions)

For the year endedAugust 31, 2017September 1, 2016September 3, 2015
Net cash provided by operating activities$1,073$836$995
Cash flows from investing activities
Purchases of available-for-sale securities(1,239)(859)(1,799)
Expenditures for property, plant, and equipment(694)(651)(609)
Payments to settle hedging activities(279)(155)(135)
Cash contributions to subsidiaries(2)(111)(151)
Cash paid for acquisitions—(216)(57)
Proceeds from sales of available-for-sale securities7761,0151,045
Proceeds from settlement of hedging activities19533778
Proceeds from maturities of available-for-sale securities194582536
(Payments) proceeds on loans to subsidiaries, net54(550)65
Cash distributions from subsidiaries334733
Other772(7)
Net cash provided by (used for) investing activities(955)(489)(1,001)
Cash flows from financing activities
Repayments of debt(1,711)(332)(1,645)
Payments of licensing obligations(83)(83)(82)
Cash paid to acquire treasury stock(35)(148)(884)
Proceeds from issuance of stock to Nanya986——
Proceeds from issuance of stock under equity plans1424874
Proceeds from settlement of capped calls125——
Proceeds from issuance of debt—1,9932,050
Proceeds from equipment sale-leaseback transactions—216—
Other(69)(46)(36)
Net cash provided by (used for) financing activities(645)1,648(523)
Effect of changes in currency exchange rates on cash, cash equivalents, and restricted cash8——
Net increase (decrease) in cash, cash equivalents, and restricted cash(519)1,995(529)
Cash, cash equivalents, and restricted cash at beginning of period2,7167211,250
Cash, cash equivalents, and restricted cash at end of period$2,197$2,716$721

See accompanying notes to condensed financial statements.

MICRON TECHNOLOGY, INC.

SCHEDULE I

CONDENSED FINANCIAL INFORMATION OF THE REGISTRANT

NOTES TO CONDENSED FINANCIAL STATEMENTS

(All tabular amounts in millions)

Basis of Presentation

Micron, a Delaware corporation, was incorporated in 1978. Micron is the parent company of its consolidated subsidiaries and, together with its consolidated subsidiaries, is a global leader in advanced semiconductor systems. These condensed financial statements have been prepared on a parent-only basis, and as such, reflect transactions in a manner that may be different than the consolidated financial statements. Under this parent-only presentation, Micron's investments in its consolidated subsidiaries are presented under the equity method of accounting. In accordance with Rule 12-04 of Regulation S-X, these parent-only financial statements do not include all of the information and footnotes required by Generally Accepted Accounting Principles (GAAP) in the United States for annual financial statements. Because these parent-only financial statements and notes do not include all of the information and footnotes required by GAAP in the United States for annual financial statements, they should be read in conjunction with Micron's audited Consolidated Financial Statements contained within Part II, Item 8 of this Annual Report on Form 10-K for the year ended August 31, 2017.

Debt

20172016
InstrumentStated RateEffective RateCurrentLong-TermTotalCurrentLong-TermTotal
Capital lease obligationsN/A3.34%$45$126$171$70$171$241
2022 Notes5.88%6.14%————590590
2022 Term Loan B3.80%4.22%57257305730735
2023 Notes5.25%5.43%—991991—990990
2023 Secured Notes7.50%7.69%—1,2381,238—1,2371,237
2024 Notes5.25%5.38%—546546—546546
2025 Notes5.50%5.56%—515515—1,1391,139
2026 Notes5.63%5.73%—128128—446446
2032C Notes(1)2.38%5.95%—211211—204204
2032D Notes(1)3.13%6.33%—159159—154154
2033E Notes(1)(2)1.63%4.50%202—202—168168
2033F Notes(1)2.13%4.93%278—278—271271
2043G Notes(3)3.00%6.76%—671671—657657
Other notes1.65%1.65%—1010—1010
$530$5,320$5,850$75$7,313$7,388
(1)Since the closing price of Micron's common stock exceeded 130% of the conversion price per share for at least 20 trading days in the 30 trading-day period ended on June 30, 2017, these notes are convertible by the holders through the calendar quarter ended September 30, 2017. The closing price of Micron's common stock also exceeded the thresholds for the calendar quarter ended September 30, 2017; therefore, these notes are convertible by the holders through December 31, 2017. The 2033 Notes were classified as current as of August 31, 2017 because the terms of these notes require us to pay cash for the principal amount of any converted notes and holders of these notes had the right to convert their notes as of that date.
(2)The net carrying amount for 2017 included $31 million of derivative debt liabilities recognized as a result of our election to settle entirely in cash converted notes with an aggregate principal amount of $16 million. See "Convertible Senior Notes" below.
(3)The 2043G Notes have an original principal amount of $820 million that accretes up to $917 million through the expected term in November 2028 and $1.03 billion at maturity in 2043.

Micron's convertible and other senior notes are unsecured obligations that rank equally in right of payment with all of Micron's other existing and future unsecured indebtedness, and are effectively subordinated to all of its other existing and future secured indebtedness, to the extent of the value of the assets securing such indebtedness. As of August 31, 2017, Micron had $3.70 billion of unsecured debt (net of unamortized discount and debt issuance costs), including all of its convertible notes and the 2023 Notes, 2024 Notes, 2025 Notes, and 2026 Notes, that was structurally subordinated to all liabilities of its subsidiaries, including trade payables. The terms of all of Micron's indebtedness generally contain cross payment and cross acceleration provisions. As of August 31, 2017, Micron had guaranteed $4.16 billion of certain debt obligations of its subsidiaries, but does not guarantee the MMJ Creditor Payments (see "Commitments" below.) Micron's guarantees of its subsidiary debt obligations are unsecured obligations ranking equally in right of payment with all of Micron's other existing and future unsecured indebtedness.

The 2022 Term Loan B and 2023 Secured Notes are collateralized by substantially all of the assets of Micron and MSP, a subsidiary of Micron, subject to certain permitted liens on such assets. Included in Micron's balance sheet as of August 31, 2017 were $8.36 billion of assets which collateralize these notes, which includes $2.14 billion investment in subsidiaries. The 2022 Term Loan B Notes and 2023 Secured Notes are structurally subordinated to the indebtedness and other liabilities of all of Micron's subsidiaries that do not guarantee these debt obligations. MSP guarantees both of these notes.

Capital Lease Obligations

As of August 31, 2017 and September 1, 2016, Micron had production equipment with carrying values of $155 million and $226 million, respectively, under capital leases.

Convertible Senior Notes, Senior Secured Notes, and Unsecured Senior Notes

For further information, see "Part II – Item 8. Financial Statements and Supplementary Data – Notes to Consolidated Financial Statements – Debt."

Maturities of Notes Payable and Future Minimum Lease Payments

As of August 31, 2017, maturities of notes payable and future minimum lease payments under capital lease obligations were as follows:

Notes PayableCapital Lease Obligations
2018$211$51
201923144
202030556
202119532
2022713—
2023 and thereafter4,365—
Unamortized discounts and interest, respectively(341)(12)
$5,679$171

Commitments

Micron has provided various financial guarantees issued in the normal course of business on behalf of its subsidiaries. These contracts include debt guarantees and guarantees of certain banking facilities. Micron enters into these arrangements to facilitate commercial transactions with third parties by enhancing the value of the transaction to the third party. Micron has entered into agreements covering certain activities of its subsidiaries, and occasionally Micron may be required to perform under such agreements on behalf of its subsidiaries.

As of August 31, 2017, the maximum potential amount of future payments Micron could have been required to make under its debt guarantees was approximately $4.16 billion. Substantially all of this amount relates to guarantees for debt of wholly-owned entities whereby Micron would be obligated to perform under the guarantee if a subsidiary were to default on the terms of their debt arrangements. In the event of performance under the guarantee, Micron would be permitted to seek reimbursement from the subsidiary company(ies) through liquidation of the assets which were collateral under various debt instruments. At the

time these contracts were entered into, the collateralized assets approximated the value of the outstanding guarantees. The majority of these guarantees expire at various times between January 2019 and April 2022. Micron guarantees a subsidiary credit facility that provides for up to $750 million of financing. As of August 31, 2017, there were no outstanding amounts drawn under this facility.

Micron has guaranteed the obligations of Micron Semiconductor Asia Pte. Ltd. ("MSA") and Micron Semiconductor (Xi'an) Co. Ltd. ("MXA"), each wholly-owned subsidiaries of Micron, in connection with a service agreement with Powertech Technology Inc. Xi'an ("PTI Xi'an") to provide assembly services to us at our manufacturing site in Xi'an, China. Micron would be required to pay the financial obligations of MSA and/or MXA in the event MSA and/or MXA fail to pay PTI Xi'an for services performed under the assembly services agreement. Micron's guarantee of MSA and of MXA extends through March 2022, the term of the assembly service agreement, but may be further extended through March 2024 if any party extends the assembly services agreement. The maximum potential amount of future payments Micron may be required to pay under this guarantee is indeterminable because the pricing and volume under the assembly services agreement are variable.

Micron has guaranteed the obligations of MSA under the 2021 MSAC Term Loan and the obligations of MSTW under the 2021 MSTW Term Loan. For further information, see "Part II – Item 8. Financial Statements and Supplementary Data – Notes to Consolidated Financial Statements – Debt – 2021 MSAC Senior Secured Term Loan and 2021 MSTW Senior Secured Term Loan."

Micron has guaranteed the obligations of certain of its subsidiaries to a supplier of capital equipment through June 2019. As of August 31, 2017, Micron had guaranteed $65 million of such payments.

Micron guarantees certain banking facilities for its wholly-owned consolidated entities. Substantially all of these guarantees relate to bank overdraft protections or issuance of commercial letters of credit/bank guarantees. The maximum potential amount of future payments Micron could be required to make under these guarantees of banking facilities varies based on the extent of potential credit exposure. Micron's business processes substantially mitigate the risk of wholly-owned subsidiaries overdrawing their bank accounts and the exposure under commercial letters of credit/bank guarantees is $35 million. The majority of these banking facility guarantees have no contractual expiration.

Contingencies

As is typical in the semiconductor and other high technology industries, from time to time others have asserted, and may in the future assert, that Micron and its subsidiaries' products or manufacturing processes infringe their intellectual property rights. Micron has accrued a liability and charged operations for the estimated costs of adjudication or settlement of various asserted and unasserted claims existing as of the balance sheet date. Micron is currently a party to various litigation regarding patent, commercial, and other matters. Micron is a party to the matters listed in the "Contingencies" note in the consolidated financial statements. For further information, see "Part II – Item 8. Financial Statements and Supplementary Data – Notes to Consolidated Financial Statements – Contingencies."

Redeemable Convertible Notes

For further information, see "Part II – Item 8. Financial Statements and Supplementary Data – Notes to Consolidated Financial Statements – Redeemable Convertible Notes."

Related Party Transactions

Substantially all of Micron's activities relate to manufacturing and R&D services performed for its subsidiaries and to royalties received for use of product and process technology. Micron's net sales to consolidated subsidiaries were $5.58 billion, $5.38 billion, and $5.42 billion for 2017, 2016, and 2015, respectively. Gross margins on manufacturing activities are commensurate with market rates for such services. Transactions between Micron and its consolidated subsidiaries are eliminated in consolidation.

Micron engages in various transactions with its equity method investees and eliminate the profits or losses on those transactions to the extent of its ownership interest until such time as the profits or losses are realized. For further information regarding transactions between Micron and its equity method investees, see "Part II – Item 8. Financial Statements and Supplementary Data – Notes to Consolidated Financial Statements – Equity Method Investments."

SCHEDULE II

VALUATION AND QUALIFYING ACCOUNTS

(in millions)

MICRON TECHNOLOGY, INC.

Balance at Beginning of YearBusiness AcquisitionsCharged (Credited) to Income Tax ProvisionCurrency Translation and Charges to Other AccountsBalance at End of Year
Deferred Tax Asset Valuation Allowance
Year ended August 31, 2017$2,107$—$(64)$278$2,321
Year ended September 1, 20162,05110(63)1092,107
Year ended September 3, 20152,443—(260)(132)2,051

Amounts charged to other accounts for the year ended August 31, 2017 includes $325 million as a result of the adoption of ASU 2016-09. See "Part II – Item 8. Financial Statements and Supplementary Data – Notes to Consolidated Financial Statements – Recently Adopted Accounting Standards."

  1. Exhibits.
Exhibit NumberDescription of ExhibitFiled HerewithFormPeriod EndingExhibit/ AppendixFiling Date
2.1*English Translation of Agreement on Support for Reorganization Companies with Nobuaki Kobayashi and Yukio Sakamoto, the trustees of Elpida Memory, Inc. and its wholly-owned subsidiary, Akita Elpida Memory, Inc. dated July 2, 20128-K/A2.110/31/12
2.2*English Translation of Agreement Amending Agreement on Support for Reorganization Companies, dated October 29, 2012, by and among Micron Technology, Inc. and Nobuaki Kobayashi and Yukio Sakamoto, the trustees of Elpida Memory, Inc. and Akita Elpida Memory, Inc.8-K2.310/29/12
2.3*English Translation of Agreement Amending Agreement on Support for Reorganization Companies, dated July 31, 2013, by and among Micron Technology, Inc. and Nobuaki Kobayashi and Yukio Sakamoto, the trustees of Elpida Memory, Inc. and Akita Elpida Memory, Inc.8-K2.48/6/13
2.4English Translation of the Reorganization Plan of Elpida Memory, Inc.8-K2.58/6/13
2.52016 Share Swap Agreement, dated February 3, 2016 by and among Micron Technology B.V., Micron Semiconductor Taiwan Co. Ltd. and Inotera Memories, Inc.10-Q3/3/162.64/8/16
3.1Restated Certificate of Incorporation of the Registrant8-K99.21/26/15
3.2Bylaws of the Registrant, Amended and Restated8-K99.14/15/14
4.1Indenture dated as of April 18, 2012, by and between Micron Technology, Inc. and U.S. Bank National Association, as Trustee for 2.375% Convertible Senior Notes due 20328-K4.14/18/12
4.2Indenture dated as of April 18, 2012, by and between Micron Technology, Inc. and U.S. Bank National Association, as Trustee for 3.125% Convertible Senior Notes due 20328-K4.34/18/12
4.3Form of 2032C Note (included in Exhibit 4.1)8-K4.34/18/12
4.4Form of 2032D Note (included in Exhibit 4.2)8-K4.34/18/12
4.5Indenture dated July 26, 2011, by and between Micron Technology, Inc. and U.S. Bank National Association, as Trustee for 1.875% Convertible Senior Notes due 20318-K4.37/26/11
4.6Indenture, dated as of February 12, 2013, by and between Micron Technology, Inc. and U.S. Bank National Association, as trustee8-K4.12/12/13
4.7Indenture, dated as of February 12, 2013, by and between Micron Technology, Inc. and U.S. Bank National Association, as trustee8-K4.32/12/13
4.8Form of 2033E Note (included in Exhibit 4.6)8-K4.12/12/13
4.9Form of 2033F Note (included in Exhibit 4.7)8-K4.32/12/13
4.10Indenture, dated as of November 12, 2013, by and between Micron Technology, Inc. & U.S. Bank National Association8-K4.111/18/13
4.11Form of New Note (included in Exhibit 4.10)8-K4.111/18/13
4.12Indenture dated as of December 16, 2013, by and among Micron Semiconductor Asia Pte., Ltd., Wells Fargo Bank, National Association, and Export-Import Bank of the United States10-Q2/27/144.34/7/14
4.13Indenture dated as of February 10, 2014, by and between Micron Technology, Inc. and U.S. Bank National Association, as Trustee8-K4.12/12/14
4.14Form of Note (included in Exhibit 4.13)8-K4.12/12/14
Exhibit NumberDescription of ExhibitFiled HerewithFormPeriod EndingExhibit/ AppendixFiling Date
4.15Indenture, dated as of July 28, 2014, by and between Micron Technology, Inc. and U.S. Bank National Association, as Trustee8-K4.17/29/14
4.16Form of Note (included in Exhibit 4.15)8-K4.17/29/14
4.17Indenture, dated as of April 30, 2015, by and between Micron Technology, Inc. and U.S. Bank National Association, as Trustee8-K4.14/30/15
4.18Indenture, dated as of April 30, 2015, by and between Micron Technology, Inc. and U.S. Bank National Association, as Trustee8-K4.24/30/15
4.19Form of Note (included in Exhibit 4.17)8-K4.14/30/15
4.20Form of Note (included in Exhibit 4.18)8-K4.24/30/15
4.21Indenture, dated as of February 3, 2015, by and between Micron Technology, Inc. and U.S. Bank National Association, as Trustee8-K4.12/3/15
4.22Form of Note (included in Exhibit 4.21)8-K4.12/3/15
4.23Indenture, dated as of April 26, 2016, by and among Micron Technology, Inc., the subsidiary guarantors from the time to time party thereto and U.S. Bank National Association, as trustee and collateral agent8-K4.14/26/16
4.24Form of Note (included in Exhibit 4.23)8-K4.14/26/16
4.25Section 382 Rights Agreement, dated as of July 20, 2016 by and between Micron Technology, Inc. and Wells Fargo Bank, National Association, as rights agent8-K4.17/20/16
10.1Executive Officer Performance Incentive Plan, as AmendedDEF 14AC12/12/14
10.21997 Nonstatutory Stock Option Plan, as Amended10-K8/30/1210.510/29/12
10.31998 Nonstatutory Stock Option Plan, as Amended10-K8/30/1210.710/29/12
10.42001 Stock Option Plan, as Amended10-K8/30/1210.810/29/12
10.52001 Stock Option Plan Form of Agreement8-K99.24/6/05
10.62004 Equity Incentive Plan, as Amended and Restated10-K9/1/1610.610/28/16
10.72004 Equity Incentive Plan Forms of Agreement and Terms and Conditions10-K9/1/1610.710/28/16
10.8Amended and Restated 2007 Equity Incentive Plan10-K9/1/1610.810/28/16
10.92007 Equity Incentive Plan Forms of Agreement10-K9/1/1610.910/28/16
10.10Nonstatutory Stock Option Plan, as Amended10-K9/1/1610.1010/28/16
10.11Nonstatutory Stock Option Plan Form of Agreement and Terms and Conditions10-K9/1/1610.1110/28/16
10.12Numonyx Holdings B.V. Equity Incentive PlanS-84.16/16/10
10.13Numonyx Holdings B.V. Equity Incentive Plan Forms of AgreementS-84.26/16/10
10.14*Patent License Agreement dated September 15, 2006, by and among Toshiba Corporation, Acclaim Innovations, LLC and Micron Technology, Inc.10-Q11/30/0610.661/16/07
10.15Form of Indemnification Agreement between the Registrant and its officers and directors10-Q2/27/1410.34/7/14
10.16*Master Agreement dated as of November 18, 2005, between Micron Technology, Inc. and Intel Corporation10-Q12/1/0510.1551/10/06
10.17*Supply Agreement dated as of January 6, 2006, between Intel Corporation and IM Flash Technologies, LLC10-Q12/1/0510.1631/10/06
10.18Form of Severance Agreement8-K99.211/1/07
Exhibit NumberDescription of ExhibitFiled HerewithFormPeriod EndingExhibit/ AppendixFiling Date
10.19Share Purchase Agreement by and among Micron Technology, Inc. as the Buyer Parent, Micron Semiconductor B.V., as the Buyer, Qimonda Ag as the Seller Parent and Qimonda Holding B.V., as the Seller Sub dated as of October 11, 200810-Q12/4/0810.701/13/09
10.20*2012 Master Agreement by and among Intel Corporation, Intel Technology Asia PTE LTD, Micron Technology, Inc., Micron Semiconductor Asia PTE LTD, IM Flash Technologies, LLC and IM Flash Singapore, LLP dated February 27, 201210-Q3/1/1210.1044/9/12
10.21*Second Amended and Restated Limited Liability Company Operating Agreement of IM Flash Technologies, LLC dated April 6, 2012, between Micron Technology, Inc. and Intel Corporation10-Q5/31/1210.1087/9/12
10.22*Amendment to the Master Agreement dated April 6, 2012, between Intel Corporation and Micron Technology, Inc.10-Q5/31/1210.1097/9/12
10.23*Amended and Restated Supply Agreement dated April 6, 2012, between Intel Corporation and IM Flash Technologies, LLC10-Q5/31/1210.1107/9/12
10.24*Amended and Restated Supply Agreement dated April 6, 2012, between Micron Technology, Inc. and IM Flash Technologies, LLC10-Q5/31/1210.1117/9/12
10.25*Product Supply Agreement dated April 6, 2012, among Micron Technology, Inc., Intel Corporation and Micron Semiconductor Asia Pte. Ltd.10-Q5/31/1210.1127/9/12
10.26*Wafer Supply Agreement dated April 6, 2012, among Micron Technology, Inc., Intel Corporation and Micron Semiconductor Asia Pte. Ltd.10-Q5/31/1210.1137/9/12
10.27Form of Capped Call Confirmation dated April 20128-K10.14/18/12
10.28*Supply Agreement, dated January 17, 2013, by and among Micron Technology, Inc., Micron Semiconductor Asia Pte. Ltd. and Inotera Memories, Inc.10-Q2/28/1310.1224/8/13
10.29*Joint Venture Agreement, dated January 17, 2013, by and among Micron Semiconductor B.V., Numonyx Holdings B.V., Micron Technology Asia Pacific, Inc. and Nanya Technology Corporation10-Q2/28/1310.1234/8/13
10.30*Facilitation Agreement, dated January 17, 2013, by and among Micron Semiconductor B.V., Numonyx Holdings B.V., Micron Technology Asia Pacific, Inc., Nanya Technology Corporation and Inotera Memories, Inc.10-Q2/28/1310.1244/8/13
10.31Micron Guaranty Agreement, dated January 17, 2013, by Micron Technology, Inc. in favor of Nanya Technology Corporation10-Q2/28/1310.1254/8/13
10.32*Technology Transfer and License Option Agreement for 20NM Process Node, dated January 17, 2013, by and between Micron Technology, Inc. and Nanya Technology Corporation10-Q/A2/28/1310.1268/7/13
10.33*Omnibus IP Agreement, dated January 17, 2013, by and between Nanya Technology Corporation and Micron Technology, Inc.10-Q2/28/1310.1274/8/13
10.34*Second Amended and Restated Technology Transfer and License Agreement for 68-50NM Process Nodes, dated January 17, 2013, by and between Micron Technology, Inc. and Nanya Technology Corporation10-Q/A2/28/1310.1288/7/13
10.35*Third Amended and Restated Technology Transfer and License Agreement, dated January 17, 2013, by and between Micron Technology, Inc. and Nanya Technology Corporation10-Q2/28/1310.1294/8/13
10.36*Omnibus IP Agreement, dated January 17, 2013, by and between Micron Technology, Inc. and Inotera Memories, Inc.10-Q2/28/1310.1304/8/13
Exhibit NumberDescription of ExhibitFiled HerewithFormPeriod EndingExhibit/ AppendixFiling Date
10.37*English Translation of Front-End Manufacturing Supply Agreement, dated July 31, 2013, by and between Micron Semiconductor Asia Pte. Ltd. and Elpida Memory, Inc.8-K/A10.13910/2/13
10.38*English Translation of Research and Development Engineering Services Agreement, dated July 31, 2013, by and between Micron Technology, Inc. and Elpida Memory, Inc.8-K10.1408/6/13
10.39*English Translation of General Services Agreement, dated July 31, 2013, by and between Micron Semiconductor Asia Pte. Ltd. and Elpida Memory, Inc.8-K/A10.14110/2/13
10.40Form of Capped Call Confirmation dated February 20138-K10.12/12/13
10.41Purchase Agreement, dated as of February 5, 2014, by and among Micron Technology, Inc. and Morgan Stanley & Co. LLC, Goldman, Sachs & Co. and Credit Suisse Securities (USA) LLC, as representatives of the initial purchasers8-K10.12/7/14
10.42Registration Rights Agreement, dated as of February 10, 2014, by and among Micron Technology, Inc. and Morgan Stanley & Co. LLC, Goldman, Sachs & Co. and Credit Suisse Securities (USA) LLC, as representatives of the initial purchasers8-K10.12/12/14
10.43Purchase Agreement, dated as of July 23, 2014, by and among Micron Technology, Inc. and Morgan Stanley & Co LLC, Goldman, Sachs & Co. and Credit Suisse Securities (USA) LLC, as representatives of the initial purchasers8-K10.17/24/14
10.44Registration Rights Agreement dated as of July 28, 2014, by and among Micron Technology, Inc. and Morgan Stanley & Co. LLC, Goldman, Sachs & Co. and Credit Suisse Securities (USA) LLC, as representatives of the initial purchasers8-K10.17/29/14
10.45Credit Agreement dated as of December 2, 2014 among Micron Technology, Inc. and Micron Semiconductor Products, Inc., as Borrowers, HSBC Bank USA, N.A., as Administrative Agent, Co-Collateral Agent, Joint Lead Arranger and Joint Book Runner, and certain other financial institutions party thereto as additional agents and/or lenders8-K99.112/8/14
10.46Facility Agreement, dated February 12, 2015, among Micron Semiconductor Asia Pte. Ltd., as borrower, certain financial institutions party thereto, and The Hongkong and Shanghai Banking Corporation Limited, as facility agent, security agent and account bank10-Q3/5/1510.884/10/15
10.47*2015 Supply Agreement, dated February 10, 2015, by and among Micron Technology, Inc., Micron Semiconductor Asia Pte. Ltd. and Inotera Memories, Inc.10-Q3/5/1510.904/10/15
10.48*2016 Supply Agreement, dated February 10, 2015, by and among Micron Technology, Inc., Micron Semiconductor Asia Pte. Ltd. and Inotera Memories, Inc.10-Q3/5/1510.914/10/15
10.49*Second Amended and Restated Supply Agreement, dated February 10, 2017, by and among Micron Technology, Inc., Intel Corporation and Micron Semiconductor Asia Pte. Ltd.10-Q3/2/1710.493/28/17
10.50*Amended and Restated Supplemental Wafer Supply Agreement, dated February 10, 2017, by and among Micron Technology, Inc., Intel Corporation and Micron Semiconductor Asia Pte. Ltd.10-Q3/2/1710.503/28/17
10.51*Amended and Restated Wafer Supply Agreement No. 3 dated, February 10, 2017, by and among Micron Technology, Intel Corporation and Micron Semiconductor Asia Pte. Ltd.10-Q3/2/1710.513/28/17
10.52*First Amendment to the Wafer Supply Agreement, dated September 1, 2015, by and among Micron Technology, Inc., Intel Corporation and Micron Semiconductor Asia Pte. Ltd.10-K9/3/1510.5410/27/15
Exhibit NumberDescription of ExhibitFiled HerewithFormPeriod EndingExhibit/ AppendixFiling Date
10.53Purchase Agreement, dated as of April 27, 2015, by and among Micron Technology, Inc. and Morgan Stanley & Co. LLC, Goldman, Sachs & Co. and Credit Suisse Securities (USA) LLC, as representatives of the initial purchasers8-K10.14/30/15
10.54*2016 Technology Transfer and License Option Agreement for 1X Process Node dated as of February 3, 2016 by and between Micron Technology, Inc. and Nanya Technology Corporation10-Q/A3/3/1610.569/8/16
10.55*2016 Technology Transfer and License Option Agreement for 1Y Process Node dated as of February 3, 2016 by and between Micron Technology, Inc. and Nanya Technology Corporation10-Q/A3/3/1610.579/8/16
10.56Form of Voting and Support Agreement by and among Micron Technology B.V., Micron Semiconductor Taiwan Co. Ltd., and Nanya Technology Corporation and certain of its affiliates10-Q3/3/1610.584/8/16
10.572016 First Amendment to the Second Amended and Restated Operating Agreement dated January 5, 2016 by and among Micron Technology, Inc. and Intel Corporation10-Q3/3/1610.594/8/16
10.58*Amendment to Technology Transfer and License Option Agreement for 1X Process Node dated as of May 17, 2016 by and between Micron Technology Inc. and Nanya Technology Corporation10-Q6/2/1610.607/6/16
10.59*Amendment to Technology Transfer and License Option Agreement for 1Y Process Node dated as of May 17, 2016 by and between Micron Technology Inc. and Nanya Technology Corporation10-Q6/2/1610.617/6/16
10.60Security Agreement, dated as of April 26, 2016 made by Micron Technology, Inc. and certain subsidiaries in favor of U.S. Bank National Association, as collateral agent8-K10.14/26/16
10.61Credit Agreement, dated as of April 26, 2016, by and among Micron Technology, Inc., as borrower, Morgan Stanley Senior Funding, Inc. as administrative agent and collateral agent, and the other agents party thereto and each financial institution party from time to time thereto8-K10.24/26/16
10.62Guarantee and Collateral Agreement, dated as of April 26, 2016, made by Micron Technology, Inc. and certain of its subsidiaries in favor of Morgan Stanley Senior Funding, Inc., as collateral agent8-K10.34/26/16
10.63English translation of Syndicated Loan Agreement dated October 11, 2016, as Amended on November 23, 2016 by and among Inotera Memories, Inc., Micron Semiconductor Taiwan Co., Ltd., certain financial institutions party thereto and Bank of Taiwan, as Facility Agent and Mega International Commercial Bank Co., Ltd., as Collateral Agent10-Q12/1/1610.631/9/17
10.64Deferred Compensation Plan10-Q3/2/1710.643/28/17
10.65First Amendment to the Credit Agreement, dated April 26, 2016, by and among Micron Technology, Inc., as borrower, Morgan Stanley Senior Funding, Inc. as administrative agent and collateral agent, and the other agents party thereto and each financial institution party from time to time thereto10-Q12/16/1610.651/9/17
10.66English translation of Facility Agreement dated November 18, 2016, by and among Micron Semiconductor Asia Capital II Pte. Ltd., certain financial institutions party thereto and DBS Bank Ltd., as Facility Agent, Security Agent and Account Bank10-Q12/16/1610.661/9/17
10.67Executive Agreement dated April 26, 2017 by and between Micron Technology, Inc. and Sanjay Mehrotra10-Q6/1/1710.676/30/17
Exhibit NumberDescription of ExhibitFiled HerewithFormPeriod EndingExhibit/ AppendixFiling Date
10.68Second Amendment to the Credit Agreement, dated April 26, 2017, by and among Micron Technology, Inc., as borrower, Morgan Stanley Senior Funding, Inc. as administrative agent and collateral agent, and the other agents party thereto and each financial institution party from time to time thereto10-Q6/1/1710.686/30/17
10.69English translation of the Second Amendment to the Syndicated Loan Agreement, dated as of July 14, 2017 by and among Micron Technology Taiwan, Inc., Micron Semiconductor Taiwan, Co., Ltd., certain financial institutions party thereto and Bank of Taiwan, as Facility Agent and Mega International Commercial Bank Co., Ltd., as Collateral AgentX
10.70Executive Covenant Agreement dated June 23, 2017 by and between Micron Technology, Inc. and Sumit SadanaX
10.71Second Amendment to the Amended and Restated Severance Agreement effective July 24, 2017 by and between Micron Technology, Inc. and D. Mark DurcanX
21.1Subsidiaries of the RegistrantX
23.1Consent of Independent Registered Public Accounting FirmX
31.1Rule 13a-14(a) Certification of Chief Executive OfficerX
31.2Rule 13a-14(a) Certification of Chief Financial OfficerX
32.1Certification of Chief Executive Officer Pursuant to 18 U.S.C. 1350X
32.2Certification of Chief Financial Officer Pursuant to 18 U.S.C. 1350X
101.INSXBRL Instance DocumentX
101.SCHXBRL Taxonomy Extension Schema DocumentX
101.CALXBRL Taxonomy Extension Calculation Linkbase DocumentX
101.DEFXBRL Taxonomy Extension Definition Linkbase DocumentX
101.LABXBRL Taxonomy Extension Label Linkbase DocumentX
101.PREXBRL Taxonomy Extension Presentation Linkbase DocumentX
  • Portions of this exhibit have been omitted pursuant to a request for confidential treatment filed with the Commission.

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