Item 2. PROPERTIES

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Item 2. PROPERTIES

Our corporate headquarters are located in Boise, Idaho. The following is a summary of our principal facilities as of August 30, 2018:



Location		Principal Operations
Taiwan		Wafer fabrication, component assembly and test, module assembly and test
Singapore		R&D, wafer fabrication, component assembly and test, module assembly and test
United States		R&D, wafer fabrication, reticle manufacturing
Japan		R&D and wafer fabrication
China		Component assembly and test, module assembly and test
Malaysia		Component assembly

We own or lease a number of other facilities in locations throughout the world that are used for design, R&D, and sales and marketing activities. Substantially all of our manufacturing capacity is fully utilized. Certain of our properties are collateral to secured borrowing arrangements. (See "Part II – Item 8. Financial Statements and Supplementary Data – Notes to Consolidated Financial Statements – Debt.")

We believe that our existing facilities are suitable and adequate for our present purposes. We do not identify or allocate assets by operating segment, other than goodwill. (See "Part II – Item 8. Financial Statements and Supplementary Data – Notes to Consolidated Financial Statements – Geographic Information.")

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