filings.toolsItem 2. PROPERTIES
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Item 2. PROPERTIES
Our corporate headquarters are located in Boise, Idaho. The following is a summary of our principal facilities as of August 29, 2019:
| Location | Principal Operations | |
| Taiwan | R&D, wafer fabrication, component assembly and test, module assembly and test | |
| Singapore | R&D, wafer fabrication, component assembly and test, module assembly and test | |
| Japan | R&D, wafer fabrication | |
| United States | R&D, wafer fabrication, reticle manufacturing | |
| China | Component assembly and test, module assembly and test | |
| Malaysia | Component assembly and test, module assembly and test |
We own or lease numerous other facilities in locations throughout the world used for design, R&D, and sales and marketing activities. We generally utilize all of our manufacturing capacity; however, a portion of our IMFT facility was underutilized for 2019 and 2018. We believe that our existing facilities are suitable and adequate for our present purposes. We do not identify or allocate assets by operating segment, other than goodwill. (See "Part II – Item 8. Financial Statements and Supplementary Data – Notes to Consolidated Financial Statements – Geographic Information.")
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