TE Connectivity 8-K 2025-01-31

Filed 2025-01-31. 1 sections, 10K characters. Original on sec.gov · Markdown · JSON

Form 8-K

UNITED STATES

SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

FORM 8-K

CURRENT REPORT

Pursuant to Section 13 or 15(d) of the Securities Exchange Act of 1934

Date of Report (Date of earliest event reported): January 31, 2025

TE CONNECTIVITY PLC

(Exact name of registrant as specified in its charter)

Ireland98-1779916
(Jurisdiction of Incorporation)(IRS Employer Identification Number)

001-33260

(Commission File Number)

Parkmore Business Park West

Parkmore, Ballybrit

Galway, H91VN2T, Ireland

(Address of Principal Executive Offices, including Zip Code)

+353 91 378 040

(Registrant’s telephone number, including Area Code)

Check the appropriate box below if the Form 8-K filing is intended to simultaneously satisfy the filing obligation of the registrant under any of the following provisions (see General Instruction A.2. below):

¨ Written communications pursuant to Rule 425 under the Securities Act (17 CFR 230.425)

¨ Soliciting material pursuant to Rule 14a-12 under the Exchange Act (17 CFR 240.14a-12)

¨ Pre-commencement communications pursuant to Rule 14d-2(b) under the Exchange Act (17 CFR 240.14d-2(b))

¨ Pre-commencement communications pursuant to Rule 13e-4(c) under the Exchange Act (17 CFR 240.13e-4(c))

Securities registered pursuant to Section 12(b) of the Act:

Title of each classTrading symbolName of each exchange on which registered
Ordinary Shares, Par Value $0.01TELNew York Stock Exchange
0.00% Senior Notes due 2025*TEL/25New York Stock Exchange
0.00% Senior Notes due 2029*TEL/29New York Stock Exchange
  • Issued by Tyco Electronics Group S.A., an indirect wholly-owned subsidiary of TE Connectivity plc

Indicate by check mark whether the registrant is an emerging growth company as defined in Rule 405 of the Securities Act of 1933 (§230.405 of this chapter) or Rule 12b-2 of the Securities Exchange Act of 1934 (§240.12b-2 of this chapter).

Emerging growth company ¨

If an emerging growth company, indicate by check mark if the registrant has elected not to use the extended transition period for complying with any new or revised financial accounting standards provided pursuant to Section 13(a) of the Exchange Act. ¨

Item 8.01. OTHER EVENTS.

On January 31, 2025, Tyco Electronics Group S.A. (“TEGSA”), a wholly-owned subsidiary of TE Connectivity plc (“TE Connectivity”), issued €750,000,000 aggregate principal amount of its 3.250% Senior Notes due 2033 (the “Notes”). The Notes were offered and sold by TEGSA pursuant to a registration statement on Form S-3 (Registration No. 333-282440) (the “Registration Statement”). The net proceeds from the sale of the Notes were approximately €740.1 million after deducting the underwriters’ discount but before other expenses, and will be used for general corporate purposes, which may include the repayment of outstanding debt.

The Notes are governed by an amended and restated indenture, dated as of January 31, 2025 (the “Indenture”), among TEGSA, as issuer, TE Connectivity, as parent guarantor, TE Connectivity Switzerland Ltd., as additional guarantor (“Swiss TE”), and Deutsche Bank Trust Company Americas, as trustee (the “Trustee”), as supplemented by the First Supplemental Indenture, dated as of January 31, 2025 (the “First Supplemental Indenture”), among TEGSA, as issuer, TE Connectivity, as parent guarantor, Swiss TE, as additional guarantor, and the Trustee. The Trustee will receive customary fees in connection therewith. The Notes are fully and unconditionally guaranteed as to payment on an unsecured senior basis by TE Connectivity and Swiss TE (the “Guarantees”). The Notes are TEGSA’s unsecured senior obligations and rank equally in right of payment with all of its existing and future senior debt, and senior to any subordinated indebtedness that TEGSA may incur.

The Notes were offered pursuant to an underwriting agreement (the “Underwriting Agreement”), dated as of January 28, 2025, among TEGSA, as issuer, TE Connectivity, as parent guarantor, Swiss TE, as additional guarantor, and BofA Securities Europe SA, Citigroup Global Markets Limited and J.P. Morgan Securities plc, in their capacity as representatives of the several underwriters (the “Underwriters”). Pursuant to the Underwriting Agreement and subject to the terms and conditions expressed therein, TEGSA agreed to sell the Notes to the Underwriters, and the Underwriters agreed to purchase the Notes for resale to the public. On January 28, 2025, TE Connectivity issued a press release announcing the pricing of the Notes. A copy of the press release is filed as Exhibit 99.1 hereto.

The foregoing descriptions of the Indenture, the First Supplemental Indenture and Underwriting Agreement do not purport to be complete and are qualified in their entirety by reference to the full text of the Indenture, which is filed as Exhibit 4.1 hereto, the First Supplemental Indenture, which is filed as Exhibit 4.2 hereto, and the Underwriting Agreement, which is filed as Exhibit 1.1 hereto. The foregoing documents are incorporated by reference herein.

In connection with the offering of the Notes, TE Connectivity is filing as Exhibits 5.1, 5.2, 5.3 and 5.4 hereto opinions of counsel addressing the validity of the Notes and the Guarantees and certain related matters. Such opinions are incorporated by reference into the Registration Statement.

Item 9.01. Financial Statements and Exhibits.

(d) Exhibits.

Exhibit No.Description
1.1Underwriting Agreement, dated January 28, 2025, among Tyco Electronics Group S.A., TE Connectivity plc, TE Connectivity Switzerland Ltd. and BofA Securities Europe SA, Citigroup Global Markets Limited and J.P. Morgan Securities plc, in their capacity as representatives of the several underwriters
4.1Amended and Restated Indenture, dated as of January 31, 2025, among Tyco Electronics Group S.A., as issuer, TE Connectivity plc, as parent guarantor, TE Connectivity Switzerland Ltd., as additional guarantor, and Deutsche Bank Trust Company Americas, as trustee
4.2First Supplemental Indenture, dated as of January 31, 2025, among Tyco Electronics Group S.A., as issuer, TE Connectivity plc, as parent guarantor, TE Connectivity Switzerland Ltd., as additional guarantor, and Deutsche Bank Trust Company Americas, as trustee (including form of Global Note and Guarantee)
5.1Opinion of Weil, Gotshal & Manges LLP
5.2Opinion of Allen Overy Shearman Sterling SCS
5.3Opinion of Bär & Karrer AG
5.4Opinion of Arthur Cox LLP
23.1Consent of Weil, Gotshal & Manges LLP (included in Exhibit 5.1 filed herewith)
23.2Consent of Allen Overy Shearman Sterling SCS (included in Exhibit 5.2 filed herewith)
23.3Consent of Bär & Karrer AG (included in Exhibit 5.3 filed herewith)
23.4Consent of Arthur Cox LLP (included in Exhibit 5.4 filed herewith)
99.1Press Release dated January 28, 2025
104Cover Page Interactive Data File (embedded within the Inline XBRL Document)

SIGNATURES

Pursuant to the requirements of the Securities Exchange Act of 1934, the Registrant has duly caused this report to be signed on its behalf by the undersigned hereunto duly authorized.

Date: January 31, 2025

TE CONNECTIVITY PLC
By:/s/ Harold G. Barksdale
Name:Harold G. Barksdale
Title:Vice President and
Corporate Secretary