Item 2. PROPERTIES

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Item 2. PROPERTIES

Our corporate headquarters are located in Boise, Idaho. In addition to our principal facilities described below, we own or lease numerous other facilities in locations throughout the world used for design, R&D, and sales and marketing activities. The following is a summary of our principal facilities as of September 2, 2021:


Location			Principal Operations

Taiwan			R&D, wafer fabrication, component assembly and test, module assembly and test
Singapore			R&D, wafer fabrication, component assembly and test, module assembly and test
Japan			R&D, wafer fabrication
United States			R&D, wafer fabrication, reticle manufacturing
Malaysia			Component assembly and test, module assembly and test
China			Component assembly and test, module assembly and test

We generally utilize all of our manufacturing capacity; however, a portion of our MTU facility was underutilized for 2021, 2020, and 2019 and was classified as held for sale as of September 2, 2021. We believe that our existing facilities are suitable and adequate for our present purposes. We do not identify or allocate assets by operating segment, other than goodwill. (See “Part II – Item 8. Financial Statements and Supplementary Data – Notes to Consolidated Financial Statements – Lehi, Utah Fab and 3D XPoint” and “ – Geographic Information.”)

36 | 2021 10-K

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